It should come as no surprise that semiconductors power the world. Semiconductor devices play a crucial part in technical advancements. This is true for every stage of development in modern electronics and communications.
Ensuring that semiconductors don’t fail is a top priority for companies. This is why having a static control program is best. It’s inexpensive and saves a lot of money in the long run.
Keep reading to learn the best ways to protect your semiconductors from electrostatic discharge.
What is Electrostatic Discharge?
Electrostatic discharge (ESD) is an electrical charge at rest. The charge builds up and looks for somewhere to go. This creates an electric discharge. The most familiar effect of static electricity is lightning.
ESD is the cause of a significant amount of failures in semiconductor devices. For example, you can see failures in the form of burnout, contact damage, and short. You may also see failures like gate oxide rupture leakage and resistor-metal interface damage.
Experts can detect and repair catastrophic failures earlier than latent and upset failures. Normal inspection procedures feel these failures but not the others. Therefore, latent and upset failures are costly. They can also impact the company’s reputation when working with customers.
How to Prevent ESD in Semiconductor Devices
Electronic technology advances are causing electronic circuitry to get smaller. This means they become more sensitive to ESD due to the reduced space.
Experts use protective coating for semiconductor fabrication equipment. Thermal sprays are most common. Experts apply a metallic or nonmetallic coating to electronic components to prevent ESD. Two common thermal sprays are plasma coating and powder coating.
You can use conventional plasma sprays and vacuum plasma sprays. Conventional plasma sprays range from 6,000 to 15,000°C. This exceeds the melting point of any known materials.
Conversely, vacuum plasma sprays are low-pressure. The outcome is a mire adherent coating with lower oxide contents.
With the flame powder coating process, a nozzle sprays the powdered feedstock into the oxyfuel flame. It is melted and carried by the flame to the device. As a result, substrate surface temperatures can run high because of the flame intrusion.
Experts apply the coatings with plasma spraying agglomerated and sintered powders. Common coating materials are high-purity oxide ceramics like alumina (AI2O3) and yttria (Y2O3).
There is no one solution for semiconductor coating. Your process gas determines the plasma composition. Your substrate type determines the process gas. But, spray processes continue to develop. This is because of the growth in functionally gradient materials.
Protect Your Semiconductors
Semiconductor devices fail at all stages due to ESD. Therefore, erosion prevention and protection steps are necessary. They keep smaller, modern semiconductors from failing at any stage. Coatings are a low-cost way to ensure your products are in the best condition.
Failing to safeguard your semiconductors from ESD will lead to expensive replacements. In addition, you may have unsatisfied customers. For more information about scheduling a semiconductor coating treatment, contact us at Alchemetrics Semiconductor. You can also search “semiconductor coatings near me.”